precision at the micro scale: how Tecan’s chemically etched parts empower the semiconductor industry
In the semiconductor industry, where innovation is measured in microns and milliseconds, precision manufacturing is not just a requirement—it’s a competitive advantage. Tecan, a global leader in advanced manufacturing, offers chemically etched precision parts that meet the demanding standards of semiconductor applications.
Tecan has refined the chemical etching process to deliver custom-engineered components for industries where precision is paramount—including semiconductors.
1. micron-level precision
Tecan’s etching process enables the creation of features with micron-level precision, essential for semiconductor applications such as microfluidics, MEMS, and RF shielding. The ability to produce consistent, repeatable geometries ensures optimal performance in high-frequency and high-density environments.
2. complex geometries with no mechanical stress
Unlike laser cutting or stamping, chemical etching does not introduce mechanical stress or deformation. This is particularly important for thin metal components used in semiconductor testing and packaging, where dimensional stability is critical.
3. material versatility
Tecan works with a wide range of metals including stainless steel, nickel, copper, and aluminum, allowing engineers to select the best material for their specific application. The process is compatible with heat-resistant alloys and conductive materials, making it ideal for demanding semiconductor environments.
4. scalable production
From prototyping to high-volume manufacturing, Tecan’s etching process is highly scalable. With automated systems and cleanroom facilities, Tecan ensures consistent quality across batches while maintaining short lead times and cost efficiency.
5. Integrated Finishing and Assembly
Tecan offers end-to-end solutions, ensuring that every part meets the highest standards of cleanliness and precision. This is especially valuable for semiconductor applications where contamination control is vital.
versatility
Chemical etching can be used with a wide range of materials. It allows us to work with a number of metal substrates that would not be possible using other manufacturing methods due to condutivity or fragility. Metal properties remain unchanged and surfaces are not damaged. We can work with a material thicknesses of 25 µm to 2mm. In most cases, 10% of material thickness with a minimum tolerance of 12µm is possible: Tecan’s experienced R&D team can work with you to exceed these boundaries if required.
Plating such as copper, silver, nickel, gold and tin are all available from our in-house metal finishing facility which provides a wide variety of finishes. With the full technical back-up of an on-site laboratory combined with a class 100 cleanroom area, Tecan can ensure total process control.
We provide precision parts and components including discrete component packages through to standard and bespoke RFI/EMC screening enclosures. Our precise manufacturing process can create lead frames for ever thinner package sizes, with smaller footprints and higher density leads.
example applications from Tecan
why Tecan?
With decades of experience, ISO-certified facilities, and a commitment to innovation, Tecan is a trusted partner for semiconductor companies worldwide. Their chemically etched parts offer the precision, flexibility, and reliability needed to stay ahead in a rapidly evolving, competitive industry.
stronger together
Tecan offers a diverse range of precision components designed to contribute to the efficiency and longevity of components to support the semiconductor industry.
With chemical etching at our core, we bring together micro precision technologies – from electroforming from our sister company, Veco and beyond to help manufacturers overcome complex design challenges and achieve remarkable levels of detail and quality in the production of components, ensuring optimal performance and functionality.
This approach not only enhances the capabilities of core processes but also opens up new possibilities for creating intricate and high-performance components. The combination of these technologies paves the way for innovative solutions in manufacturing, offering increased precision and efficiency in producing mission-critical parts for a wide range of industries.
