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Semiconductors are attached to these thin layers of metal frame as part of the package assembly process. Quality is essential: any tiny defect seriously affects the performance and reliability of the resulting insulated circuit device.
As semiconductor processes and design technologies become increasingly sophisticated, there is an ongoing demand for more complex, smaller and thinner assembly solutions.
Traditionally, lead frames have been machine-produced (e.g. stamped). For precision-engineered components, we advocate the chemical etching process in order to achieve a high level of accuracy, ultra-fine tolerances and a reduction in production lead time (up to one-tenth of the time compared to stamping).
- complex features
- smooth, burr and stress-free
- ultra fine tolerances
- in-house plating and finishing facility
- high lead density
- short lead times