precision etched components for data centre hardware

AI and high-performance computing are pushing data centre hardware to new limits. Higher rack densities, faster interconnects and greater power draw all create engineering pressure at the component level. Tecan supplies precision etched metal parts that address four of those pressure points: electromagnetic integrity, thermal management, power density and high-speed interconnect.

Every part is made by photochemical etching, a process that produces burr-free, stress-free components and lets designs change quickly as server and rack architectures evolve.

As compute density rises, so does electromagnetic interference between components. Tecan etches precision EMI/RFI shielding parts, including shielding cans, fences and lids, apertures and fine-feature mesh, from conductive metals to protect signal integrity in dense server and switch hardware.

Photochemical etching is well suited to shielding components because it produces clean, repeatable fine features across thin sheet without burrs that would compromise fit or contact.

Removing heat is one of the central challenges in modern data centres. Tecan manufactures etched heat spreaders, cold plate features and heat-exchanger components in high-conductivity metals such as copper, designed to move heat away from high-density compute hardware.

Etching allows complex internal channel patterns and fine surface features to be formed without mechanical stress or distortion, which matters when flatness and thermal contact are critical.

Higher power density means more demanding power-distribution hardware. Tecan etches busbars, contacts, lead frames and connector components in copper and other conductive alloys, holding tight, repeatable tolerances across high volumes.

Because etching introduces no mechanical stress or burrs, contact surfaces stay clean and consistent, supporting reliable electrical performance.

High-speed interconnect depends on precise, consistent metal contacts and fine-feature parts. Tecan etches connector contacts, contact arrays and fine-pitch components to the tolerances these applications demand, with clean edges and no heat-affected zone.

The toolless nature of etching means contact geometries can be iterated quickly during development, then locked in for volume production.

Photochemical etching offers several advantages for data centre hardware. It produces burr-free, stress-free parts with no heat-affected zone, which protects the performance of thin, fine-feature components. It carries low tooling cost, and because the process is toolless, designs can be revised quickly as rack and server architectures change. This combination of precision, speed of iteration and cost-effective scaling fits the fast-moving pace of data centre development.

Tecan etches a wide range of metals relevant to data centre hardware, including:

• Stainless steels
• Mild, carbon, tool and spring steels
• Aluminium, including aerospace grades
• Nickel alloys such as Inconel, Invar, Kovar and Alloy 42
• Copper, brass and bronze
• Molybdenum

We also offer a comprehensive range of metal finishing options, including pure gold, acid gold (nickel alloyed gold), cobalt gold, Woods nickel, sulphamate nickel, electroless nickel, bright tin, matte tin, acid copper, chemi-black, black nickel, silver, Tarniban anti-tarnish, sulphuric clear anodising, hard sulphuric anodising, and black, blue and red anodising dyes.

Components can be produced from 25µm to 2mm thick material, with a minimum feature size of approximately 20µm and typical tolerances of around ±10% of material thickness. Prototypes are produced directly from drawings, with the same design scaling to volume without new tooling.