combining chemical etching with forming and plating

With our own on-site forming, assembly and plating capabilities, our post-production engineering services can shorten the total component production process drastically. Working collaboratively with our customers allows us to provide cost-effective solutions to complex engineering requirements.

Forming and assembly services available include doming, punching, framing and bending.

TEC shield

TEC shield is essentially our ‘on-the-bench’ modelling system developed to enable RFI/EMC development engineers to prototype shielding cans, fences and lids quickly and easily. More importantly, the electronic performance or the ‘shielding effectiveness’ will be closer to a custom-manufactured can when compared to traditional ‘modelling’ techniques. The TEC shield range provides a professional and effective method to evaluate a solution.

The etched fold line principle used in the design and construction of photo-chemically machined shielding cans provides an easy method of assembly. As ‘Origami’ is for paper, the use of a TEC shield, with its etched fold lines, can be likened to starting with a blank sheet of paper.

With our own on-site world class plating facility we can provide a full plating and metal finishing service to any component we produce.

For many hi-tech and hi-spec applications, metal finishing is essential for corrosion and wear resistance, or specific functional reasons. High quality metal finishing not only helps to increase product lifetime but also allows for more flexibility regarding choice of base materials and improves product functional performance.

Our in-house laboratory facilities are used to assure finishes are technically correct and meet the requirements of individual specifications. Prior to processing, atomic absorption spectrometry is used to analyse all solutions. Post-processing, nondestructive x-ray fluorescence testing is used to ensure surface finish thickness meets with specifications. All work in progress is regularly subjected to atomic absorption wet analysis testing. Atomic solutions are tested to within 0.05 parts per million.

Tecan is a leader in electroplating processes with a wide range of material capabilities including copper, tin, gold, silver, phosphorous nickel and black nickel plating. Besides electroplating, we also offer other in-house finishing services such as anodising, passivation and insulation.

high precision and complexity:

Chemical etching allows for the creation of intricate and complex geometries with tight tolerances that are difficult to achieve with traditional machining methods

cost-effectiveness:

The process is generally more cost-effective, especially for small to medium production runs, as it eliminates the need for expensive hard tooling

burr-free and stress-free parts:

Chemical etching produces parts that are free from burrs and mechanical stresses, which is crucial for applications requiring high reliability and performance

flexibility in design:

The digital nature of the etching process allows for quick design changes and prototyping without significant cost increases

enhanced durability and functionality:

Plating services, such as adding layers of gold, copper, nickel, or silver, can enhance the durability, conductivity, and corrosion resistance of the etched parts

streamlined production:

Integrating forming and plating with etching can streamline the production process, reducing lead times and improving overall efficiency

Combining chemical etching with forming and plating services is particularly beneficial in several high-precision and high-performance applications across various industries. These combined services enable manufacturers to produce high-quality, durable, and precise components that meet the stringent requirements of these industries.

Current examples of our services include the requirement to provide a micro-precision domed nebuliser plate in large quantities at a competitive price in a demanding environment. Here are some other notable examples:

• Aerospace: Used for manufacturing lightweight, high-strength components such as turbine blades, fuel system parts, and intricate structural elements
• Medical Devices: Essential for producing precise and reliable components like surgical instruments, stents, and microelectromechanical systems (MEMS)
• Electronics: Critical for creating detailed and complex parts such as printed circuit boards (PCBs), connectors, and shielding components. Examples include pressure leaf filters and RFI shielding components
• Automotive: Applied in the production of fuel injection systems, sensors, and other precision parts that require high durability and performance
• Defence: Utilised for making components for communication systems, RFI shielding, radar equipment, and other sensitive electronic devices
• Semiconductor: create intricate patterns and structures on semiconductor wafers, essential for manufacturing microelectronic components. Forming processes help produce lead frames with precise dimensions and high-density leads, which are crucial for packaging semiconductor devices while plating services, such as gold, copper, nickel, and tin plating, enhance the conductivity, corrosion resistance, and overall performance of semiconductor components

Combining chemical etching with plating and forming under one roof results in enhanced efficiency, and versatility. This powerful synergy is transforming manufacturing processes, enabling the production of high-quality, intricate components across various industries.

Making complex parts manufacturable

Employing the right technology for each feature

Simplifying the supply chain