While we can use chemical etching in a wide range of metals, here we look at what to consider when choosing the right metal for use specifically in the semiconductor industry.
As an alloy made of copper, nickel and zinc, this is hard, flexible and ductile. Moreover, it is non-magnetic with high corrosion resistance, solderability and does not need to be plated.
Common uses: EMC /RFI shielding
Less conductive than other metals, when it is plated with tin, steel is highly conductive and easily soldered. Cold Rolled Steel is especially strong, making it formable, has good spring properties and retains its shape when formed.
Common uses: EMC /RFI shielding
This type of steel is highly resistant to moisture-related corrosion and has excellent thermal conductivity, making it a preferred choice of metal in the semiconductor industry.
Common uses: high tension springs, filters, and EMC/RFI shielding
Copper has excellent thermal and electrical conductivity with respect to its raw cost when compared to precious metals like gold and silver, and it is highly effective in weakening magnetic and electrical waves. In addition, it can be soldered, is strong, is corrosion resistant and also recyclable. Because it is vulnerable to oxidisation, it is a good idea to plate copper to protect it.
Common uses: lead frames, EMC/ RFI shielding, contacts, pins, terminals, connectors, and bus bars
An alloy of copper and zinc, brass has high electrical, thermal conductivity, strength, and corrosion resistance. It is a highly formable metal that makes it suitable for forming and retaining shape
Common uses: springs, contacts, connectors, and lead frames, EMC/RFI shielding and bus bars.
including: low thermal coefficient materials such as Kovar and Aloy 42