lead frames
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Semiconductors are attached to these thin layers of metal frame as part of the package assembly process. Quality is essential: any tiny defect seriously affects the performance and reliability of the resulting insulated circuit device.

lead frames

As semiconductor processes and design technologies become increasingly sophisticated, there is an ongoing demand for more complex, smaller and thinner assembly solutions.

Traditionally, lead frames have been machine-produced (e.g. stamped). For precision-engineered components, we advocate the chemical etching process in order to achieve a high level of accuracy, ultra-fine tolerances and a reduction in production lead time (up to one-tenth of the time compared to stamping).

solution

  • complex features
  • smooth, burr and stress-free
  • ultra fine tolerances
  • in-house plating and finishing facility
  • high lead density
  • short lead times
lead frames

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Frequently Asked Questions

Yes. Tecan manufactures precision etched lead frames by photochemical etching for semiconductor and electronics packaging, in a wide range of designs and materials.

Lead frames are the metal structures that support a semiconductor chip and connect it electrically to the circuit board, providing both mechanical support and the electrical interconnect within an integrated circuit package.

Photochemical etching produces lead frames with clean, burr-free, stress-free features and no heat-affected zone, which protects the fine detail and flatness that packaging requires. Because it uses digital tooling, designs can be changed quickly and prototyped without the high tooling cost of stamping and other traditional processes.

Lead frames are typically etched from copper and copper alloys for conductivity (other options are available), as well as nickel alloys and Alloy 42 where a controlled expansion match is needed. We also have plating and finishing capability on site.

Yes. Tecan offers in-house plating, including finishes such as gold, silver, nickel and tin, to improve conductivity, solderability and durability.

Tecan etches lead frames to a minimum feature size of approximately 20µm, holding a typical tolerance of ±10% of material thickness above 0.15mm, and ±15µm minimum below 0.15mm, on material from 25µm to 2mm thick.

Yes. Because photochemical etching uses digital tooling, Tecan quickly produces bespoke lead frames to your specification, with prototypes made directly from drawings and the same design scaled to volume.

Send your drawings, material, quantity and tolerances via the Request a Quote page and Tecan will provide a quotation.