RFI shields: total enclosures

Total enclosures are often used to shield single or multiple PCBs, where the enclosure becomes the outer case for the components or assembly. They are used for anything from a low power radio module to a complete equipment enclosure.

In the case of the smaller modules the enclosure forms five sides of the unit and the PCB noncomponent side forms the sixth side.

Other forms of enclosure involve PCB standoffs fixed to the enclosure and different forms of module lid, providing access to the PCB for future adjustment or rework.

see also, our article on shielding options

One of the benefits of the chemical etching process, is that module and connection features can be etched into the enclosure, as well as various connector or lead-through-component apertures.

These enclosures, like the PCB mounted versions, can form a very good EMC shield, providing the PCB RF ground is correctly terminated. Fabricated enclosures provide a cost-effective alternative to die cast enclosures, particularly for custom applications.

Chemical etching from Tecan allows for precise and intricate designs to be achieved with high accuracy. It ensures that shields are consistent in depth and uniformity, which is crucial for their effectiveness in blocking electromagnetic interference. Performance is further enhanced as chemical etching results in burr-free edges – essential to maintaining signal integrity and meeting stringent requirements for electromagnetic compatibility.

Additionally, chemical etching is a cost-effective manufacturing process, especially for producing RFI shields in large quantities. The ability to create complex patterns and shapes with minimal tooling costs makes it a favorable choice for many industries.

• faster production cycles
• minimal tooling costs
• design flexibility
• inclusion of complex patterns and shapes (e.g. features like access holes, ventilation, fold lines, logos, and part numbers) at no additional cost
• short timescales, even at high volume
• cost-effective