For those engineers who want to test if an RFI enclosure is required, Tecan offers the TECpack series of products.


levels of shielding

TECpack is a range of ‘on-the-bench’ modelling systems based on a pre-fabricated sheet matrix system with the appearance of graph paper, from which engineers can create individual cans, fences and lids for testing enclosure design. Compared to traditional modelling techniques, the electronic performance or the shielding effectiveness of the TECPack model will be closer to a custom manufactured can.

TECpack allows engineers make their own enclosures to establish the need or otherwise of an enclosure. This might be undertaken, for example, at a test house when a product has failed radiated tests.

the range includes:

  • TECshield: pre-scored matrices for simple can and lid construction on copper sheet with a semi-etched cut-n-fold grid system, electroplated with bright acid tin for long life solderability.
  • TECshield Plus: the same concept but with hexagonal shaped holes positioned within individual grid squares. This prevents ‘hot-boxing’ which occurs when heat generating components are enclosed in an air tight shielding can.
  • TECwall: single sheets of side walls
  • TECshield 3-in-1: All three types on a single sheet for maximum versatility and convenience

See more on our TECPack page

 

 

using TECPack

  1. draw onto the TECshield sheet the flat development of the shielding can to be made, adopting the pre-etched grid system.
  2. cut around the shape. The semi-etched grid lines make cutting regular and easy.
  3. simply fold all four sides of the can to 90 degrees. If required, the joins can easily be soldered to form an airtight enclosure.

 

why use chemical etched RFI shields?

Chemical etching from Tecan allows for precise and intricate designs to be achieved with high accuracy. It ensures that shields are consistent in depth and uniformity, which is crucial for their effectiveness in blocking electromagnetic interference. Performance is further enhanced as chemical etching results in burr-free edges – essential to maintaining signal integrity and meeting stringent requirements for electromagnetic compatibility.

Additionally, chemical etching is a cost-effective manufacturing process, especially for producing RFI shields in large quantities. The ability to create complex patterns and shapes with minimal tooling costs makes it a favorable choice for many industries.

  • faster production cycles
  • minimal tooling costs
  • design flexibility
  • inclusion of complex patterns and shapes (e.g. features like access holes, ventilation, fold lines, logos, and part numbers) at no additional cost
  • short timescales, even at high volume
  • cost-effective
chemical etching

go to our RFI solutions page

EMC/RFI Shields