Unlike other manufacturing methods, with chemical etching it does not matter whether the metal is strong, hard, soft or brittle. Material properties do not present the same limitations as, for example, stamping when it comes to manufacturing components.

While we can use chemical etching in a wide range of metals, here we look at what to consider when choosing the right metal for use specifically in the semiconductor industry.


nickel /silver

As an alloy made of copper, nickel and zinc, this is hard, flexible and ductile. Moreover, it is non-magnetic with high corrosion resistance, solderability and does not need to be plated.

Common uses: EMC /RFI shielding


Less conductive than other metals, when it is plated with tin, steel is highly conductive and easily soldered. Cold Rolled Steel is especially strong, making it formable, has good spring properties and retains its shape when formed.

Common uses: EMC /RFI shielding

stainless steel

This type of steel is highly resistant to moisture-related corrosion and has excellent thermal conductivity, making it a preferred choice of metal in the semiconductor industry.

Common uses: high tension springs, filters, and EMC/RFI shielding


Copper has excellent thermal and electrical conductivity with respect to its raw cost when compared to precious metals like gold and silver, and it is highly effective in weakening magnetic and electrical waves. In addition, it can be soldered, is strong, is corrosion resistant and also recyclable. Because it is vulnerable to oxidisation, it is a good idea to plate copper to protect it.

Common uses: lead frames, EMC/ RFI shielding, contacts, pins, terminals, connectors, and bus bars


beryllium copper

Of all the copper alloys, beryllium copper is the most conductive and the strongest, making it easy to form and retain complex shapes

Common uses: contacts and springs.


An alloy of copper and zinc, brass has high electrical, thermal conductivity, strength, and corrosion resistance. It is a highly formable metal that makes it suitable for forming and retaining shape

Common uses: springs, contacts, connectors, and lead frames, EMC/RFI shielding and bus bars.

phosphorous bronze

Made up of copper and zinc, this is an excellent choice for components due to its superior spring qualities, high fatigue resistance, excellent malleability, and high corrosion resistance.

Common uses: battery contacts and springs.



to follow:

typical materials we work with

  • Aluminium
  • Beryllium Copper
  • Brass
  • Copper
  • Molybdenum
  • Nickel
  • Nitinol
  • Phosphorous Bronze
  • Stainless Steel
  • Steel
  • Titanium

including: low thermal coefficient materials

see also: SMT stencils

stencils and squeegee blades